the video has an disassembly of the nuc and the question I have relates heavily to its heat sink. My goal, is to cast a copper heat sink and apply it to the exisiting heat sink. The die of the sink will be mounted in a hollowed out book's binding, drawing heat from within outward. the problem I'm unsure about obviously is weather or not it will work
The heat sink itself seems at least vaguely sound, there are fan less heat sinks available on the market and some of them approach the amount of surface area and amount of copper I hope to use. that doesn't necissarily mean it will work though, or be something you could physically touch. but before we get into "will the copper be cool enough to touch" A much higher priority is "this heat sink wont be bottlenecked ontop of the existing heat sink for some reason and fry my cpu."
The video shows the heat sink is dark black, while the other images show a copper heat sink. assuming thermal paste and a plate, I'd like to get some idea of how effectively you could draw heat from the processor. gaming laptops seem to do just fine for what they're capable of, the thing runs hot and the fan is obviously on all the time in them, but the CPU doesn't generally die while the heat is making its way to that fan. but this is more like attaching a heat sink to a heat sink and I'm just not confident without someone to explain to me any technical hurdles this idea might introduce.
regardless of what you end up going with, you need to make sure that surface of the cpu and heatsink is mirror finish and apply a small bead of thermal paste. if its made of copper and has fans, it most likey wont overheat.
Are you sure paper transmits heat well enough that thing won't fry? I guess it should be ok but can't say for sure.
Are you retarded? You basically HAVE to put it in a vacuum chamber anyways because otherwise you’d constantly have to cool the liquid nitrogen and it would waste a boatload of energy. Putting it in a vacuum chamber prevents ice formation because there isn’t any water to freeze. There isn’t any air which contains a small percentage of water vapor.
OP, please don't listen to this LARPer. Here's a WAY easier solution: get a modest liquid cooler, leave the radiator outside the case.
Any particle interaction between the liquid nitrogen and anything else will heat it faster and make costs higher. This is because temperature is average kinetic energy per unit volume. When you remove the particle interactions entirely via a much simpler and more effective vacuum chamber you end up with lower costs, even when you include maintenance. ;)
ok mr college enough of your lectures none of us could afford a setup like that
how do you prevent it from catching fire?
that looks great, you should leave that in a public place and walk away briskly
Conformal coating. Oil bath.
not him but the average cpu won't burn cardboard. unless your chips are reaching over 450F you won't burn cardboard